Saffi | 1-2 Saffi |
Ħxuna lesta | 16-134mil (0.4mm-3.4mm) |
Max. Dimensjoni | 500mm * 1200mm |
Ħxuna tar-ram | 35um, 70um, 1 sa 10oZ |
Min Wisa' tal-Linja/Spazju | 4mil (0.1mm) |
Daqs tat-Toqba Min Lest | 0.95mm |
Min. Drill Daqs | 1.00mm |
Max. Drill Daqs | 6.5mm |
Tolleranza tad-Daqs tat-Toqba lesti | ± 0.050mm |
Preċiżjoni tal-Pożizzjoni tal-Apertura | ± 0.076mm |
Min SMT PAD Daqs | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm (2mil) |
Min.Solder Mask Cover | 0.05mm (2mil) |
Maskra tal-istann Ħxuna | > 12um |
Irfinar tal-wiċċ | HAL, HAL Bla ċomb, OSP, Immersion Gold, eċċ |
HAL Ħxuna | 5-12um |
Ħxuna tad-Deheb tal-Immersjoni | 1-3mil |
Ħxuna tal-Film OSP | ENTEK PLUS HT:0.3-0.5um; F2: 0.15-0.3um |
Outline Finishing | Rotot & Punching; Devjazzjoni ta 'preċiżjoni ± 0.10mm |
Konduttività Termali | 1.0 sa 12w/mk |
FOB Port | Shenzhen |
Dimensjonijiet tal-Kartuna tal-Esportazzjoni L/W/H | 36 x 26 x 25 Ċentimetru |
Ħin taċ-Ċomb | 3–7 ijiem |
Unitajiet għal kull Kartuna tal-Esportazzjoni | 5.0 |
Piż tal-Kartuna tal-Esportazzjoni | 18 Kilogramma |